BondHub Imaging Bond Tester

NDT Systems is proud to announce the launch of the world's first multimode imaging bond tester with fully automatic C-scan imaging capability. The BondHub imaging Bond Tester utilizes the full capability of the well-established BondScope 3100 and connects to any of our manual or automatic scanners to generate high-resolution C-scan images in Pitch-catch, MIA and Resonance modes.

Inspection of composites and adhesively bonded materials has not seen such an advancement for many years. The power of full-field inspection images using bond testing elevates non-destructive inspection capability to a new level imaging bond testing offers many advantages.